Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras.
The Package on package (PoP) market was valued at xx Million US$ in 2020 and is projected to reach xx Million US$ by 2026, at a CAGR of xx% during the forecast period. In this study, 2020 has been considered as the base year and 2021 to 2026 as the forecast period to estimate the market size for Package on package (PoP).
This report covers the present status and the future prospects of the global Package on package (PoP) market for 2015-2026.
The report offers detailed coverage of Package on package (PoP) industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Package on package (PoP) by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
Eesemi, Surface Mount Technology Association, PCBCart, Amkor Technology, Micron Technoloty, Semicon, Finetech, Circuitnet
Market Segment as follows:
Market by Order Type
PoPb
PoPt
Package on package (PoP) Breakdown Data by Application
Mobile Phones
Personal Digital Assistants (PDA)
Digital Cameras
Others
Package on package (PoP) market while maintaining their competitive edge over their competitors. The report offers detailed and crucial information to understand the overall market scenario.
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Package on package (PoP) market for the forecast period 2021 - 2026?
• What are the driving forces in the Package on package (PoP) market for the forecast period 2021 - 2026?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Package on package (PoP) industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?
Note – In order to provide more accurate market forecast, all our reports will be updated before delivery by considering the impact of COVID-19.