The report on the Global 3D Sensors Market gives an estimation of the development of the market based on historical studies and also provides forecasts on the basis of comprehensive research. The report gives a complete market analysis for the forecasted period from 2020 to 2026. The market is divided into various segments with an in-depth outlook of the competitors and a listing of the profiled key players. The market size in terms of revenue (USD MN) is calculated and provided for the study period along with the dynamics of the market such as the drivers and the restraints.
Major Drivers |
Major Restraints |
- Growing demand for 3D-enabled devices in consumer electronics
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- High cost required for maintenance of these devices
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- Integration of optical and electronic components in miniaturized electronics devices
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- Interface integration in different devices
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- Growing use of 3D sensing technology in gaming applications
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- Increasing requirement of security and surveillance systems
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The comprehensive value chain analysis of the market will assist in attaining better product differentiation, along with detailed understanding of the core competency of each activity involved. The market attractiveness analysis provided in the report aptly measures the potential value of the market providing business strategists with the latest growth opportunities.
The report classifies the market into different segments based on type, technology, and application. These segments are studied in detail incorporating the market estimates and forecasts at regional and country level. The segment analysis is useful in understanding the growth areas and probable opportunities of the market.
Geographical Leader |
Leading Segment |
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- By Type - 3D Image Sensor
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- By Technology - Time-Of-Flight
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- By Application - Entertainment
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The report also covers the complete competitive landscape of the worldwide market with company profiles of key players such as:
- Infineon Technologies AG
- Microchip Technology Inc.
- Omnivision Technologies, Inc.
- PMD Technologies AG
- Softkinetic
- Asustek Computer Inc.
- Cognex Corporation
- IFM Electronic GmbH
- Intel Corporation
- LMI Technologies, Inc.
- Microsoft Corporation
- Occipital, Inc.
- Qualcomm Inc.
A detailed description of each has been included, with information in terms of H.Q, future capacities, key mergers & acquisitions, financial overview, partnerships, collaborations, new product launches, new product developments and other latest industrial developments.
SEGMENTATIONS IN THE REPORT:
By Type:
- Image Sensors
- 3D Image Sensor Technology Based on Pixel Size
- Cmos 3D Image Sensor
- 3D Electro-Optical Image Sensors
- 3D Time-Of-Flight Image Sensor
- Position Sensor
- Acoustic Sensor
- Accelerometer Sensor
- Others
By Technology:
- Comparison of Technologies
- Stereo Vision
- Structured Light
- Time-Of-Flight
- Ultrasound
By Applications:
- Consumer Electronics
- Smartphone
- Laptop
- Camera
- Wearable Electronics
- Television
- Tablet Pc
- Scanner
- Others
- Healthcare
- Aerospace & Defense
- Industrial Robotics
- Entertainment
- Automotive
- Security & Surveillance
- Others
By Geography:
- North America
- Europe
- Asia Pacific
- Rest of the World
The Global 3D Sensors Market has been exhibited in detail in the following chapters -
Chapter 1 3D Sensors Market Preface
Chapter 2 Executive Summary
Chapter 3 3D Sensors Industry Analysis
Chapter 4 3D Sensors Market Value Chain Analysis
Chapter 5 3D Sensors Market Analysis By Type
Chapter 6 3D Sensors Market Analysis By Technology
Chapter 7 3D Sensors Market Analysis By Applications
Chapter 8 3D Sensors Market Analysis By Geography
Chapter 9 Competitive Landscape Of 3D Sensors Companies
Chapter 10 Company Profiles Of 3D Sensors Industry
METHODOLOGY:
A combination of primary and secondary research has been used to determine the market estimates and forecasts. Sources used for secondary research include (but not limited to) Paid Data Sources, Company Websites, Technical Journals, Annual Reports, SEC Filings and various other industry publications. Specific details on methodology used for this report can be provided on demand.