Wafer-level packaging (WLP) is the technology of packaging an integrated circuit while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits (dice) and then packaging them.
The report offers detailed coverage of Wafer Level Packaging Technologies industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Wafer Level Packaging Technologies by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
The report forecast global Wafer Level Packaging Technologies market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2025.
First, this report covers the present status and the future prospects of the global Wafer Level Packaging Technologies market for 2015-2025.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
Samsung Electro-Mechanics
TSMC
Amkor Technology
Orbotech
Advanced Semiconductor Engineering
Deca Technologies
STATS ChipPAC
Nepes
At the same time, we classify Wafer Level Packaging Technologies according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
Market by Order Type
Fan-In Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Market by Application
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Others
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Wafer Level Packaging Technologies market for the forecast period 2021 - 2025?
• What are the driving forces in the Wafer Level Packaging Technologies market for the forecast period 2021 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Wafer Level Packaging Technologies industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?