Solder Paste Inspection (SPI) System Market (Updated Version Available)

The report offers detailed coverage of Solder Paste Inspection (SPI) System industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Solder Paste Inspection (SPI) System by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
This report studies the Solder Paste Inspection (SPI) System market, Solder Paste Inspection is mainly done to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a PCB assembly are because of improper solder paste printing. With the help of solder paste inspection (SPI), you can reduce the defects related to soldering by a considerable amount.

Importance of Solder Paste Inspection Process
Here are some of the key points of information, which prove the importance of SPI process:
Improves PCB Quality & Performance: This process makes use of advanced equipment for precise inspection. Angle cameras are used to take 3D pictures, which are very helpful in measuring the alignment and volume of the solder paste. This helps improve the yield, as well as the print quality. Furthermore, it helps improve the performance of the PCBs.

Advanced Equipment for Better Control & Monitoring: As said earlier, angle cameras are used, which produce clear 3D pictures. Unlike the traditional cameras, 3D cameras are capable of capturing the height of the solder paste printed. This facilitates precise measurement of the solder paste volume. Thus, with the help of SPI coupled with automated optical inspection, manufacturers can easily monitor and control the component placement and solder paste printing processes.

Helps Reduce Solder Errors: Important information about the printing process can be obtained by doing the solder paste inspection. It gives a clear idea about the causes of defects, thus allowing you to make the necessary changes and reduce the errors to a minimum.

Numerous studies have been performed over the last few years proving that up to 70% of all SMD solder joint issues, can be traced back to the solder paste printing process. These printing errors may be caused by incorrect printer setup, stencil damage, stencil design or type, solder paste type, solder paste conditions or a collection of several issues.
The global Solder Paste Inspection (SPI) System market concentration rate is high and dominated by several players from Korea, Taiwan, Japan, United States and Germany; Koh Young, MirTec Ltd, PARMI Corp and Pemtron are from Korea; Test Research, Inc (TRI) and Jet Technology from Taiwan; CyberOptics Corporation, Machine Vision Products (MVP), Caltex Scientific and ASC International from United States; and Viscom AG and Vi TECHNOLOGY from Europe. In 2017, Koh Young and Test Research, Inc (TRI) occupied more than 60 percent of global market.
Currently, In-line SPI systems are dominating the market, due to the superior performance and the market demand. The SPI system market is mainly driven by the demand from Automotive and Consumer Electronics; other end market like communications, aerospace and medical fields will play more and more role in future.

The report forecast global Solder Paste Inspection (SPI) System market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2025.

First, this report covers the present status and the future prospects of the global Solder Paste Inspection (SPI) System market for 2015-2025.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].

Key Companies
Koh Young (Korea)
CyberOptics Corporation
Test Research, Inc (TRI) (Taiwan)
MirTec Ltd (Korea)
PARMI Corp (Korea)
Viscom AG (Germany)
ViTrox (Malaysia)
Vi TECHNOLOGY (France)
Mek (Marantz Electronics) (Japan)
CKD Corporation (Japan)
Pemtron (Korea)
SAKI Corporation (Japan)
Machine Vision Products (MVP) (US)
Caltex Scientific (US)
ASC International (US)
Sinic-Tek Vision Technology (China)
Shenzhen JT Automation Equipment (China)
Jet Technology (Taiwan)


At the same time, we classify Solder Paste Inspection (SPI) System according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.

Market Segment as follows:
Market by Order Type
In-line SPI System
Off-line SPI System
Market by Application
Automotive Electronics
Consumer Electronics
Industrials
Others

By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]

The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Solder Paste Inspection (SPI) System market for the forecast period 2021 - 2025?
• What are the driving forces in the Solder Paste Inspection (SPI) System market for the forecast period 2021 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Solder Paste Inspection (SPI) System industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?