3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).
The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.
On the basis of type, the 3D Time-of-flight Image Sensor market is segmented into Half-QQVGA ToF Image Sensor, QVGA ToF Image Sensor, and Others. The QVGA ToF Image Sensor segment is expected to account for the larger share of the global market in 2017.
End-users, included in this market are Consumer Electronics, Robotics and Drone, Machine Vision and Industrial Automation, Entertainment, Automobile, and Others usage. The Consumer Electronics application is expected to account for the largest share of the global market in 2017.
Based on regions, the global 3D Time-of-flight Image Sensor market is segmented into North America, Europe, China, Japan, Korea, Asia Other, and the Rest of the World (ROW). USA and Europe is expected to account for larger share and China is growing fastest of the market during the forecast period.
The report offers detailed coverage of 3D Time-of-flight Image Sensors industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading 3D Time-of-flight Image Sensors by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
The report forecast global 3D Time-of-flight Image Sensors market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2021-2025.
First, this report covers the present status and the future prospects of the global 3D Time-of-flight Image Sensors market for 2015-2025.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
Texas Instruments
STMicroelectronics
PMD Technologies
Infineon
PrimeSense (Apple)
MESA (Heptagon)
Melexis
ifm Electronic
Canesta (Microsoft)
Espros Photonics
TriDiCam
At the same time, we classify 3D Time-of-flight Image Sensors according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market Segment as follows:
Market by Order Type
Half-QQVGA ToF Image Sensor
QVGA ToF Image Sensor
Others
Market by Application
Consumer Electronics
Robotics and Drone
Machine Vision and Industrial Automation
Entertainment
Automobile
Others
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the 3D Time-of-flight Image Sensors market for the forecast period 2021 - 2025?
• What are the driving forces in the 3D Time-of-flight Image Sensors market for the forecast period 2021 - 2025?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the 3D Time-of-flight Image Sensors industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?