EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.
The report offers detailed coverage of Epoxy Encapsulation Materials industry and main market trends. The market research includes historical and forecast market data, demand, application details, price trends, and company shares of the leading Epoxy Encapsulation Materials by geography. The report splits the market size, by volume and value, on the basis of application type and geography.
The report forecast global Epoxy Encapsulation Materials market to grow to reach xxx Million USD in 2020 with a CAGR of xx% during the period 2020-2028.
First, this report covers the present status and the future prospects of the global Epoxy Encapsulation Materials market for 2015-2028.
And in this report, we analyze global market from 5 geographies: Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia], Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland], North America[United States, Canada, Mexico], Middle East & Africa[GCC, North Africa, South Africa], South America[Brazil, Argentina, Columbia, Chile, Peru].
Key Companies
Sumitomo Bakelite
Hitachi Chemical
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Hexion
Nepes
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material
At the same time, we classify Epoxy Encapsulation Materials according to the type, application by geography. More importantly, the report includes major countries market based on the type and application.
Market by Order Type
Normal Epoxy Molding Compound
Green Epoxy Molding Compound
Market by Application
Semiconductor Encapsulation
Electronic Components
Market Segment as follows:
By Region
Asia-Pacific[China, Southeast Asia, India, Japan, Korea, Western Asia]
Europe[Germany, UK, France, Italy, Russia, Spain, Netherlands, Turkey, Switzerland]
North America[United States, Canada, Mexico]
Middle East & Africa[GCC, North Africa, South Africa]
South America[Brazil, Argentina, Columbia, Chile, Peru]
The research provides answers to the following key questions:
• What is the estimated growth rate and market share and size of the Epoxy Encapsulation Materials market for the forecast period 2020 - 2028?
• What are the driving forces in the Epoxy Encapsulation Materials market for the forecast period 2020 - 2028?
• Who are the prominent market players and how have they gained a competitive edge over other competitors?
• What are the market trends influencing the progress of the Epoxy Encapsulation Materials industry worldwide?
• What are the major challenges and threats restricting the progress of the industry?
• What opportunities does the market hold for the prominent market players?